Dispenser for chemical-mechanical polishing (CMP) apparatus, CMP apparatus having the dispenser, and CMP process using the CMP apparatus

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United States of America Patent

PATENT NO 9205529
APP PUB NO 20120329278A1
SERIAL NO

13165763

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Abstract

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A dispenser for a chemical-mechanical polishing (CMP) apparatus, includes a delivery arm disposed over a polishing pad of a CMP apparatus, at least a slurry delivery groove formed in the delivery arm and extending along a length of the delivery arm, and a plurality of first openings connected to the slurry delivery groove.

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Patent Owner(s)

Patent OwnerAddress
UNITED MICROELECTRONICS CORPHSIN-CHU CITY 300

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Wen-Yen Miaoli County, TW 60 853
Chih, Chin-Chuan Miaoli County, TW 1 3
Ham, Liang-Chuo Hsinchu, TW 1 3
Lee, Jiann-Mo Hsinchu, TW 1 3
Yang, Chia-Ming New Taipei, TW 48 147

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