Substrate cleaning method and substrate cleaning device
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United States of America Patent
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Dec 8, 2015
Grant Date -
Mar 7, 2013
app pub date -
Feb 3, 2011
filing date -
Feb 19, 2010
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Abstract
A substrate cleaning method includes removing a foreign material attached to a substrate while preventing deterioration of the substrate and any film formed on or above the substrate. A cleaning gas at a pressure between 0.3 MPa and 2.0 MPa is sprayed towards a wafer W with attached foreign material 22 placed in a near-vacuum, producing clusters 21 made up of a multitude of gas molecules 20, and the clusters 21 collide with the wafer W without undergoing ionization.
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