Metal-bonded diamond grinding wheel prepared by self-propagating pressure-less sintering and a preparation method thereof

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United States of America Patent

PATENT NO 9211633
SERIAL NO

13504459

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Abstract

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The invention discloses a metal-bonded diamond grinding wheel prepared by self-propagating pressure-less sintering and a preparation method thereof. The metal bonded diamond grinding wheel mainly comprises a working layer and a non-working layer, wherein the working layer comprises metal bond and grinded diamond, the non-working layer is metal bond, and the metal bond in the working layer and non-working layer have the same components that comprise metal powders of Cu, Al, Ni, Ti, Sn, and Co. To prepare the metal-bonded diamond grinding wheel prepared by self-propagating pressure-less sintering solves the problems of high energy consumption and low manufacture efficiency in the current sintering processes of the metal bonded diamond grinding wheel, and improves the binding force of the metal bond to the grinded diamond by forming carbides between the bond and the grinded diamond.

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Patent Owner(s)

Patent OwnerAddress
ZHENGZHOU RESEARCH INSTITUTE FOR ABRASIVES & GRINDING CO LTD450001 121 WUTONG STREET ZHENGZHOU NEW AND HIGH TECH ZONE HENAN ZHENGZHOU CITY HENAN PROVINCE 450001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Mingyao Zhengzhou, CN 30 11
Shao, Junyong Zhengzhou, CN 3 3
Xia, Juxue Zhengzhou, CN 1 2

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