Very thin dielectrics for high permittivity and very low leakage capacitors and energy storing devices
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United States of America Patent
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Dec 15, 2015
Grant Date -
Jan 1, 2015
app pub date -
Sep 19, 2014
filing date -
Oct 3, 2008
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Abstract
Methods are disclosed for creating extremely high permittivity dielectric materials for use in capacitors and energy storage devices. High permittivity materials suspended in an organic non-conductive media matrix with enhanced properties and methods for making the same are disclosed. Organic polymers, shellac, silicone oil, and/or zein formulations are utilized to produce thin film low conductivity dielectric coatings. Transition metal salts as salt or oxide matrices are formed at low temperatures utilizing mild reducing agents.
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