Package on package structures and methods for forming the same
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United States of America Patent
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Dec 22, 2015
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N/A
app pub date -
Jun 18, 2012
filing date -
Apr 16, 2012
priority date (Note) -
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Abstract
The described embodiments of mechanisms of forming a package on package (PoP) structure involve bonding with connectors with non-solder metal balls to a packaging substrate. The non-solder metal balls may include a solder coating layer. The connectors with non-solder metal balls can maintain substantially the shape of the connectors and control the height of the bonding structures between upper and lower packages. The connectors with non-solder metal balls are also less likely to result in bridging between connectors or disconnection (or cold joint) of bonded connectors. As a result, the pitch of the connectors with non-solder metal balls can be kept small.
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