Solder alloy, solder paste, and electronic circuit board

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United States of America Patent

PATENT NO 9221129
APP PUB NO 20150136461A1
SERIAL NO

14410862

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Abstract

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A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.

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Patent Owner(s)

Patent OwnerAddress
HARIMA CHEMICALS INCORPORATEDKAKOGAWA-SHI HYOGO 675-0019

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ikeda, Kazuki Hyogo, JP 43 271
Imamura, Yoji Hyogo, JP 3 82
Piao, JinYu Hyogo, JP 3 68
Takemoto, Tadashi Ibaraki, JP 106 989

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