Integrated circuit package and method of making the same

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United States of America Patent

PATENT NO 9224676
SERIAL NO

14592648

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Abstract

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Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.

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First Claim

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Patent Owner(s)

  • AMKOR TECHNOLOGY, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Glenn, Thomas P Gilbert, US 139 8244

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