Compound structural frame with integrally formed thermal cooling channels and method of using same
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United States of America Patent
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Jan 5, 2016
Grant Date -
Apr 9, 2015
app pub date -
Dec 16, 2014
filing date -
Mar 16, 2013
priority date (Note) -
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Abstract
A support for plural display modules each including a rearwardly extending heat sink includes a compound structural frame that defines a frame frontside, a frame backside, and a vertical cooling conduit, the frame backside for mounting the structural frame to a mounting structure, the frame frontside defining a bay member, the bay member defining an opening that couples to the vertical cooling conduit, the bay member configured to receive and support one of the display modules with the heat sink extending through the opening and into the vertical cooling conduit whereby the display module is convectively cooled by the vertical motion of air through the cooling conduit.
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