Lead-free glass for semiconductor encapsulation

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9230872
APP PUB NO 20130090227A1
SERIAL NO

13805039

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The technical task of the present invention is to provide a lead-free glass for semiconductor encapsulation, which is easy to automate an appearance inspection, and furthermore, has excellent refinability and encapsulatability of semiconductor devices. In the lead-free glass for semiconductor encapsulation according to the present invention, a temperature at which the viscosity of glass is 106 dPa·s is 670° C. or lower, and, as a glass composition, the content of CeO2 is from 0.01 to 6% by mass, and the content of Sb2O3 is 0.1% by mass or less.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • NIPPON ELECTRIC GLASS CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashimoto, Koichi Shiga, JP 146 1956

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 5, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00