Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the same
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United States of America Patent
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Jan 5, 2016
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app pub date -
Feb 18, 2015
filing date -
Feb 19, 2014
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Abstract
A method of making a semiconductor device is characterized by the step of attaching a chip-on-interposer subassembly to a heat spreader with the chip inserted into a cavity of the heat spreader and the interposer laterally extending beyond the cavity. The interposer backside process is executed after the chip-on-interposer attachment and encapsulation to form the finished interposer. The heat spreader provides thermal dissipation, and the finished interposer provides primary fan-out routing for the chip. In the method, a buildup circuitry is electrically coupled to the interposer to provide further fan-out routing.
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