Interconnect crack arrestor structure and methods

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United States of America Patent

PATENT NO 9230932
APP PUB NO 20130207239A1
SERIAL NO

13370127

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Abstract

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A system and method for preventing cracks is provided. An embodiment comprises placing crack stoppers into a connection between a semiconductor die and a substrate. The crack stoppers may be in the shape of hollow or solid cylinders and may be placed so as to prevent any cracks from propagating through the crack stoppers.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shih, Da-Yuan Hsin-Chu, TW 185 11160
Yu, Chen-Hua Hsin-Chu, TW 2039 41205

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