High speed differential wiring in glass ceramic MCMS
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United States of America Patent
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Jan 5, 2016
Grant Date -
May 28, 2015
app pub date -
Dec 11, 2013
filing date -
Nov 22, 2013
priority date (Note) -
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Abstract
The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed.
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