Fiber optic transceiver with a heat dissipating structure
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United States of America Patent
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Jan 12, 2016
Grant Date -
N/A
app pub date -
Oct 1, 2014
filing date -
Oct 1, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A fiber optic transceiver comprising a substrate, a heat dissipating structure, a receptacle and a light source is disclosed. The substrate may have a hole extending therethrough. The heat dissipating structure may be coupled to the substrate and may comprise a major surface, a plurality of fins, a projecting member, and a plurality of insulating protrusions. The plurality of fins may project from the major surface of the heat dissipating structure away from the substrate. The projecting member may extend partially or completely through the hole of the substrate. The plurality of insulating protrusions may extend substantially perpendicularly from the major surface of the heat dissipating structure and coupled to the substrate. The plurality of insulating protrusions may be configured to separate the major surface of the heat dissipating structure with the substrate so as to reduce heat transfer between the substrate and the heat dissipating structure.
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