Chip-type electric double layer capacitor cell and method of manufacturing the same
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United States of America Patent
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Jan 12, 2016
Grant Date -
Aug 21, 2014
app pub date -
Apr 29, 2014
filing date -
Nov 5, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A chip-type electric double layer capacitor includes: a resin case having a housing space provided therein and formed of insulating resin; first and second external terminals inserted into the resin case by insert injection molding, each having a first portion exposed to an outer surface of the resin case for external contact and a second portion exposed to an inner surface of the housing space for internal contact; a sealing portion including a groove portion provided in the resin case along a circumference of at least one of the first and second external terminals and a resin filling the groove portion; and an electric double layer capacitor cell mounted in the housing space and electrically connected to the second portion of the first and second external terminals.
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