Padless via

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9237651
APP PUB NO 20150092381A1
SERIAL NO

14565383

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Abstract

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One disclosed embodiment comprises formation of a padless via in a substrate. The padless via includes a hole through a metal layer blanketing the substrate, as well as the underlying substrate. An inner wall of the padless via hole receives a seed layer of a conductive material. Electrolytic differential plating is then performed, resulting in a preferential accumulation of a conductive plating material on the via inner wall, relative to that deposited on a surface of the substrate. In one embodiment, the differential plating is performed by addition of an organic suppressant to a plating bath.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zhang, Tonglong Irvine, US 20 229

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