Electronic circuit apparatus
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United States of America Patent
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Jan 12, 2016
Grant Date -
Aug 27, 2015
app pub date -
Aug 30, 2013
filing date -
Sep 13, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor includes electrodes at both ends. One of the two electrodes is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted. A current-generating-side pattern and a current-receiving-side pattern are arranged separately from the surface-mounting pattern. The current-generating-side pattern and the surface-mounting pattern are connected together via a connection member which creates a space between itself and a substrate.
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