Polishing pad having porogens with liquid filler

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United States of America Patent

PATENT NO 9238294
APP PUB NO 20150367478A1
SERIAL NO

14307846

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Abstract

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Polishing pads having porogens with liquid filler and methods of fabricating polishing pads having porogens with liquid filler are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a polymer matrix and a plurality of porogens dispersed throughout the polymer matrix. Each of the plurality of porogens has a shell with a liquid filler. The liquid filler has a boiling point less than 100 degrees Celsius at a pressure of 1 atm, a density less than water, or both.

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Patent Owner(s)

Patent OwnerAddress
CMC MATERIALS LLC1209 ORANGE STREET WILMINGTON DE 19801

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Allison, William C Beaverton, US 49 675
Lefevre, Paul Andre Portland, US 20 260

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