Method of fabricating thermal conductive polymer
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United States of America Patent
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Jan 19, 2016
Grant Date -
Apr 30, 2015
app pub date -
Oct 29, 2014
filing date -
Oct 30, 2013
priority date (Note) -
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Abstract
Provided is a method of fabricating a thermal conductive polymer, including: a) fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation; and d) converting the dry filament into the gel filament by adding the first solvent to the dry filament; e) removing the first solvent from the converted gel filament; and f) quaternarily elongating the gel filament from which the first solvent is removed.
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