Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
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United States of America Patent
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Jan 19, 2016
Issued Date -
N/A
app pub date -
Dec 29, 2014
filing date -
Aug 23, 2006
priority date (Note) -
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Abstract
Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
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