Wired circuit board and producing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9241410
APP PUB NO 20130014976A1
SERIAL NO

13485274

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Importance

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Abstract

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A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimura, Yoshito Osaka, JP 33 88
Ishigaki, Saori Osaka, JP 5 23
Ishii, Jun Osaka, JP 193 1956
Sugimoto, Yuu Osaka, JP 39 177

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