Electronic device housing and method for manufacturing the same

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United States of America Patent

PATENT NO 9241435
SERIAL NO

13709472

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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An electronic device housing includes a plastic substrate. The plastic substrate includes a first surface. The electronic device housing further includes an activating layer formed on the first surface. The activating layer contains metal powder. The activating layer defines a recessed portion. Some of the metal powder is partially exposed on the surface of the recessed portion. Some of metal powder is partially inserted into the plastic substrate corresponding to the recessed portion. The electronic device housing further includes an antenna layer formed on the recessed portion. The antenna layer is a metal layer. A method for manufacturing the electronic device housing is also disclosed.

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Patent Owner(s)

  • FIH (HONG KONG) LIMITED;SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ho, Po-Feng New Taipei, TW 37 865
Yan, Shi-Jie Shenzhen, CN 3 8

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