Circuit board

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United States of America Patent

PATENT NO 9245667
APP PUB NO 20140275335A1
SERIAL NO

13846631

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Importance

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Abstract

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The invention provides a circuit board comprising a substrate and a dielectric material provided on the substrate. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

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Patent Owner(s)

Patent OwnerAddress
ITEQ CORPORATIONNO 17 DALUGE RD XINPU TOWNSHIP HSINCHU COUNTY 30544

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Li-Chun Taoyuan County, TW 27 250
Yin, Meng-Song Taoyuan County, TW 16 48

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