Planing device and method
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United States of America Patent
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Feb 2, 2016
Grant Date -
May 23, 2013
app pub date -
Nov 23, 2011
filing date -
Nov 23, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A planing device with a feed path for moving a material piece. The device includes a cutterhead on one side of the feed path, and a hold down unit on an opposing second side. The hold down unit includes a contact member that is held in a downward position towards the feed path. A cut control member is positioned upstream from the cutterhead. In use, the depth of cut and resulting amount of material removed from the one surface of the piece is dependent upon the thickness of the piece. One or more additional cutterheads may be positioned downstream to remove additional material from the piece.
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