Cutting apparatus and method
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United States of America Patent
Stats
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Feb 2, 2016
Grant Date -
Feb 7, 2013
app pub date -
Jul 26, 2012
filing date -
Aug 3, 2011
priority date (Note) -
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Abstract
A cutting device 1 comprises: a guiderail (18) that is formed into a ring shape along the circumference around the central axis (10c) of a cutting drive unit (10); a laser irradiation unit (22) that is movable along the guiderail, and irradiates a laser at a predetermined inclination angle onto an object (30) to be cut; a preset cutting position derivation unit (26a) for deriving a preset cutting position that corresponds to a preset cutting portion, which is the portion to be cut by a cutting tool (10b) after a predetermined amount of time; a stopping position derivation unit (26b) for deriving the stopping position of the laser irradiation unit on the guiderail with the preset cutting position that was derived as a target; and a laser irradiation drive unit (24) for moving the laser irradiation unit to the derived stopping position.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- SUBARU CORPORATION
International Classification(s)
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- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Nishikawa, Hirozi | Tokyo, JP | 1 | 6 |
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