Apparatus and method for characterizing adhesive bonding and osseointegration
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United States of America Patent
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Feb 2, 2016
Grant Date -
Jun 5, 2014
app pub date -
May 31, 2013
filing date -
Jun 1, 2012
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Abstract
An apparatus and method is provided for characterizing adhesive bonding using an acoustic wave MEMS sensor. The sensor can consist of a silicon substrate, a thin aluminum nitride film on top of the substrate and a thin gold film above the aluminum nitride layer. An adhesive layer is added on top of the sensor and the dispersion property of acoustic waves in the layered configuration can be utilized for bonding integrity characterization. A wave dispersion model is developed to study the effect of changing the interface stiffness on the wave dispersion profile and to investigate the sensitivity of different sensor configurations. The results of the model illustrate that the dispersion profile shifts in the direction of decreasing wave velocity as the interface stiffness decreases.
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