Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component
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United States of America Patent
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-
Feb 2, 2016
Grant Date -
Mar 20, 2014
app pub date -
Nov 22, 2013
filing date -
Jul 14, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An approach is provided in which a pH-indicating compound is incorporated in a printed circuit board. The printed circuit board includes a number of layers with the pH-sensitive indicator being incorporated in one of the layers. Conductive pathways are formed from a conductive sheet laminated onto an outer surface of the printed circuit board. The printed circuit board is exposed to a pH-activating solution. Plated-through hole defects in the printed circuit board are identified by detecting a color formation at a surface location of the printed circuit board that corresponds to the plated-through hole defect. Another approach is also provided where a pH-activating compound is incorporated in one of the layers of the printed circuit board which is then exposed to a pH-indicating solution to produce the color formation that identifies the location of the plated-through hole defect.
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