Substrate dividing method
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United States of America Patent
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Mar 15, 2016
Grant Date -
Oct 29, 2015
app pub date -
Jul 7, 2015
filing date -
Jul 7, 2015
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.
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