High power module cooling system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9252069
APP PUB NO 20120048515A1
SERIAL NO

12873226

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A cooling apparatus includes a direct-bonded copper (“DBC”) substrate, the DBC substrate having a plurality of micro-structure tabs formed on a fluid impingement side of the DBC substrate, and a jet head in complementary opposition to the fluid impingement side. The jet head has a first plurality of micro-jets facing the fluid impingement side, each of the first plurality of micro-jets having a nozzle, and a second plurality of micro-jets facing the fluid impingement side so the jet head is configured to deliver a fluid to the plurality of micro-structure tabs through the first and second plurality of micro-jets.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TELEDYNE SCIENTIFIC & IMAGING, LLC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhunia, Avijit Agoura Hills, US 17 125
Chen, Chung-Lung Thousand Oaks, US 24 375
Gardner, Mark R Oxnard, US 4 327
Moffatt, Alex P Thousand Oaks, US 3 132

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Aug 2, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00