Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly
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United States of America Patent
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-
Feb 2, 2016
Issued Date -
N/A
app pub date -
Dec 4, 2013
filing date -
Oct 31, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board. The card includes an upper card connected to the upper portion of the casing, and a lower card connected to the lower portion of the casing. The upper card includes one of a photosensor, light emitting element, radio frequency (RF) antenna, and radio frequency emitter. The lower card includes an area array input/output.
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