Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture
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United States of America Patent
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Feb 2, 2016
Grant Date -
Jan 14, 2016
app pub date -
Jul 10, 2014
filing date -
Jul 10, 2014
priority date (Note) -
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Abstract
Semiconductor integrated circuits (110) or assemblies are disposed at least partially in cavities between two interposers (120). Conductive vias (204M) pass through at least one of the interposers or at least through the interposer's substrate, and reach a semiconductor integrated circuit or an assembly. Other conductive vias (204M.1) pass at least partially through multiple interposers and are connected to conductive vias that reach, or are capacitively coupled to, a semiconductor IC or an assembly. Other features are also provided.
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