Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding
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United States of America Patent
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Feb 2, 2016
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Oct 2, 2014
app pub date -
Mar 29, 2013
filing date -
Mar 29, 2013
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Abstract
Methods of producing a semiconductor package using dual-sided thermal compression bonding includes providing a substrate having an upper surface and a lower surface. A first device having a first surface and a second surface can be provided along with a second device having a third surface and a fourth surface. The first surface of the first device can be coupled to the upper surface of the substrate while the third surface of the second device can be coupled to the lower surface of the substrate, the coupling occurring simultaneously to produce the semiconductor package.
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