Coupling arrangement

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United States of America Patent

PATENT NO 9252474
APP PUB NO 20140111293A1
SERIAL NO

14143200

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A coupling arrangement for the transfer of a microwave signal includes a motherboard having a first substrate with a first microstrip conductor, and a module having a second substrate with a second microstrip conductor. The module is attached to the motherboard such that the motherboard conductor by means of a connection is in electrical contact with the module conductor, whereby the microwave signal may be transferred between the motherboard conductor and the module conductor. The connection includes the motherboard conductor connected to a substrate integrated waveguide on the motherboard, which substrate integrated waveguide is connected to the module conductor via a slot coupling.

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Patent Owner(s)

  • HUAWEI TECHNOLOGIES CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bergstedt, Leif Varberg, SE 34 481
Madeberg, Bengt Stockholm, SE 4 24

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