Polishing apparatus, polishing pad, and polishing information management system
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United States of America Patent
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Feb 9, 2016
Grant Date -
Feb 28, 2013
app pub date -
Mar 9, 2011
filing date -
Mar 19, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A polishing pad has structural parts embedded therein; sensors, a memory for storing detected information obtained by the sensors, and a communication unit driven by a power supply unit to communicate with outside in a non-contact manner. The polishing pad and a communication unit configured to communicate with the communication unit of the polishing pad in a non-contact manner constitute a polishing information management system. The polishing pad and a communication unit configured to transmit and receive the information to and from the communication unit of the polishing pad in a non-contact manner constitute a polishing apparatus.
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