LED package and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9257618
APP PUB NO 20120292644A1
SERIAL NO

13342653

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Abstract

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The present invention provides a Light Emitting Diode (LED) package, comprising a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting the light emitted from the LED into white light by changing a wavelength of the light, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
LIGHTIZER CO LTDA-906 357 GUSEONG-RO GIHEUNG-GU YONGIN-SI GYEONGGI-DO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Byoung gu Seoul, KR 22 44
Min, Jae-Sik Seoul, KR 45 174

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