Package substrate and die spacer layers having a ceramic backbone

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United States of America Patent

PATENT NO 9258880
APP PUB NO 20130341076A1
SERIAL NO

13987701

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Abstract

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A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aleksov, Aleksandar Chandler, US 305 1216
Ganapathysubramanian, Shankar Phoenix, US 18 101
Noveski, Vladimir Chandler, US 14 185
Sharan, Sujit Chandler, US 223 3221

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