Circuit materials, circuits laminates, and method of manufacture thereof

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United States of America Patent

PATENT NO 9258892
APP PUB NO 20150030824A1
SERIAL NO

14334876

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Abstract

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A circuit subassembly is disclosed comprising a conductive metal layer and a dielectric substrate layer having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006 at 10 GHz, wherein the composition of the dielectric substrate layer comprises about 5 to about 70 volume percent of borosilicate microspheres that have been treated with an alkaline solution.

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Patent Owner(s)

Patent OwnerAddress
ROGERS CORPORATION2225 WEST CHANDLER BOULEVARD CHANDLER AS 85224

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Crosley, Jessica Chandler, US 1 45

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