Selective clamping of electronics card to coolant-cooled structure
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United States of America Patent
Stats
-
Feb 9, 2016
Grant Date -
Feb 26, 2015
app pub date -
Oct 30, 2014
filing date -
Mar 1, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.
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