Package with metal-insulator-metal capacitor and method of manufacturing the same
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United States of America Patent
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Feb 16, 2016
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app pub date -
Feb 11, 2013
filing date -
Feb 11, 2013
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Abstract
A package includes a chip that has a metal-insulator-metal (MIM) capacitor formed in a first polymer layer and a metallic pillar formed on the MIM capacitor. A molding compound surrounds the chip, a second polymer layer is formed on the chip and the molding compound, a third polymer layer is formed on the second polymer layer, an interconnect structure is formed between the second polymer layer and the third polymer layer and electrically coupled to the metallic pillar and the MIM capacitor, and a bump is formed over and electrically coupled to the interconnect structure.
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