LED package improved structure and fabricating method thereof
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United States of America Patent
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Feb 16, 2016
Grant Date -
Dec 10, 2015
app pub date -
Oct 20, 2014
filing date -
Jun 9, 2014
priority date (Note) -
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Abstract
A LED (Light-Emitting Diode) package structure is provided. The LED package improved structure includes a base, a plurality of metallic nanoparticles and a LED unit. The base has an accommodating space, wherein the accommodating space has a bottom surface and at least one side surface surrounding the bottom surface. The metallic nanoparticles cover the bottom surface and/or the side surface. The LED unit is disposed in the accommodating spare, in which light emitted from the LED unit is reflected or scattered by the metallic nanoparticles, each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated.
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