Curable composition, cured coating film prepared from curable composition, and printed wiring board including the cured film
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United States of America Patent
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Feb 16, 2016
Grant Date -
Oct 2, 2014
app pub date -
Mar 27, 2014
filing date -
Mar 29, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A curable composition to be used for a printed wiring board is disclosed, which has an excellent flexibility and an excellent adhesive property with respect to both a plastic substrate and a conductive layer in the printed wiring board. The curable composition includes (A) a (meth)acrylate compound having a polyene structure, (B) a (meth)acrylate compound having a hydroxyl group; and (C) a photopolymerization initiator. From the curable composition, a cured coating film, and a printed wiring board including the cured coating film in the form of a predetermined pattern are obtained.
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