Wafer edge warp suppression for thin wafer supported by tape frame

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United States of America Patent

PATENT NO 9269604
APP PUB NO 20150311107A1
SERIAL NO

14542422

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Abstract

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Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of reducing edge warping in a supported semiconductor wafer involves adhering a backside of a semiconductor wafer to an inner portion of a carrier tape of a substrate carrier comprising a tape frame mounted above the carrier tape. The method also involves adhering an adhesive tape to a front side of the semiconductor wafer and to at least a portion of the substrate carrier. The adhesive tape includes an opening exposing an inner region of the front side of the semiconductor wafer.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eaton, Brad Menlo Park, US 112 1447
Kumar, Ajay Cupertino, US 489 10777
Lei, Wei-Sheng San Jose, US 131 1181

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