Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
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United States of America Patent
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Feb 23, 2016
Grant Date -
Dec 3, 2015
app pub date -
Aug 13, 2015
filing date -
Oct 18, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the semiconductor package to a mounting surface. The semiconductor package also includes a control FET of a power converter switching stage having a control drain attached to the die side of the control conductive carrier. The control conductive carrier is configured to sink heat produced by the control FET into the mounting surface. The semiconductor package includes a sync conductive carrier having another die side and another opposite I/O side connecting the semiconductor package to the mounting surface, and a sync FET of the power converter switching stage having a sync source attached to the die side of the sync conductive carrier.
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