Packaging methods and packaged semiconductor devices

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United States of America Patent

PATENT NO 9269687
SERIAL NO

14265164

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Abstract

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Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Meng-Tse Changzhi Township, TW 100 1568
Cheng, Ming-Da Jhubei, TW 447 4774
Lin, Chih-Wei Xinfeng Township, TW 359 5145
Lin, Chun-Cheng New Taipei, TW 100 1465
Lin, Wei-Hung Xinfeng Township, TW 175 1616
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Tsai, Yu-Peng Taipei, TW 43 1203

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