Method and localized haptic response system provided on an interior-facing surface of a housing of an electronic device
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United States of America Patent
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Feb 23, 2016
Grant Date -
Jul 10, 2014
app pub date -
Jan 6, 2014
filing date -
Nov 21, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A housing for an electronic device allows a haptic feedback response that is localized to a specific area on a back panel of the housing of the electronic device. For example, a user holding the mobile electronic device may directly receive haptic feedback in his/her fingers that are supporting the back side of the mobile electronic device. Those specific areas on the back panel may be locations where the panel material is thinned, or locations where the panel material has been removed and replaced by a suitably selected membrane material having favorable mechanical properties. The membrane material may be introduced as an embossment of a membrane layer. In addition, a force-sensing resistor type material may be used as a replacement material, so as to sense the pressure of a user's finger pressing on the embossed structure at the specific locations to which EMP actuators are bonded.
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