Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer
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United States of America Patent
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Feb 23, 2016
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N/A
app pub date -
Mar 14, 2013
filing date -
Dec 6, 2012
priority date (Note) -
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Abstract
The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.
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