Hot melt assist waterborne adhesives and use thereof

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United States of America Patent

PATENT NO 9273230
SERIAL NO

13804230

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Abstract

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A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAARUHRSTRASSE 19 HAMBURG 22761

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harrington, John Ledgewood, US 27 366
Huang, Tianjian Hillsborough, US 35 212
Layser, James Easton, US 1 12
Mammarella, Robert Greer, US 1 6
Meccia, John Ringoes, US 17 75
Thompson, Kristina Clinton, US 18 89

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