Photosensitive polyimide composition, base agent thereof, method of making the base agent, and solder-resistant polyimide thin film made from the composition
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United States of America Patent
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Mar 15, 2016
Grant Date -
Jan 21, 2016
app pub date -
Jul 16, 2014
filing date -
Jul 16, 2014
priority date (Note) -
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Abstract
A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.
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