Chip level EMI shielding structure and manufacture method thereof
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United States of America Patent
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Mar 15, 2016
Grant Date -
Apr 12, 2012
app pub date -
Mar 22, 2011
filing date -
Oct 8, 2010
priority date (Note) -
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Abstract
A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost.
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