Plasma thermal shield for heat dissipation in plasma chamber
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United States of America Patent
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Mar 22, 2016
Grant Date -
Jun 18, 2015
app pub date -
Dec 17, 2013
filing date -
Dec 17, 2013
priority date (Note) -
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Abstract
Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a plasma thermal shield for a plasma processing chamber includes an annular ring body having an inner opening. A plasma-facing surface of the annular ring body has a general topography. A bottom surface of the annular ring body reciprocates the general topography with recessed regions disposed therein, providing one or more protruding regions at the bottom surface of the annular ring body.
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