Semiconductor wafer manufacturing method

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United States of America Patent

PATENT NO 9293318
APP PUB NO 20150162181A1
SERIAL NO

14406625

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Abstract

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A method of manufacturing a semiconductor wafer includes: rough-polishing front and back surfaces of the semiconductor wafer; mirror-polishing a chamfered portion of the rough-polished semiconductor wafer; performing mirror finish polishing on the front surface or both the front and back surfaces of the semiconductor wafer having the mirror-polished chamfered portion; and forming an oxide film on an entire surface of the semiconductor wafer after the mirror-polishing of the chamfered portion and before the mirror finish polishing.

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Patent Owner(s)

Patent OwnerAddress
SUMCO TECHXIV CORPORATIONOMURA-SHI NAGASAKI 856-8555

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yamashita, Kenji Tokyo, JP 60 415

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